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US 2022/0068867 A1Published application
Electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsFeng Kao, Lung-Yuan Wang
Life of this patent
Estimating the term…
Abstract
An electronic package is provided, which stacks an electronic structure as an integrated voltage regulator on an electronic component to facilitate close-range cooperation with the electronic component for electrical transmission.
Claims20
An electronic package, comprising:
- an electronic structure including an electronic body with a first side and a second side opposite to each other, one or more conductors being formed on the first side of the electronic body;
- an electronic component combined with the conductors of the electronic structure;
- one or more conductive pillars disposed on the electronic component, wherein the electronic component is electrically connected with the conductive pillars and the conductors;
- and
- an encapsulating layer formed on the electronic component and encapsulating the electronic structure and the conductive pillars.
2 more elements
A method of manufacturing an electronic package, comprising:
- providing an electronic body with a first side and a second side opposite to each other;
- forming one or more conductors on the first side of the electronic body to form an electronic structure;
- disposing the electronic structure on an electronic component via the conductors, with a plurality of conductive pillars formed on the electronic component, wherein the electronic component is electrically connected with the conductive pillars and the conductors;
- and
- forming an encapsulating layer on the electronic component to encapsulate the electronic structure and the conductive pillars.
2 more elements
Dependencies are inferred from the claim text.