Semiconductor package and manufacturing method of the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorHsin He HUANG
Life of this patent
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Abstract
A semiconductor device includes a semiconductor die having a first surface and a second surface opposite to the first surface, a plurality of first real conductive pillars in a first region on the first surface, and a plurality of supporters in a second region adjacent to the first region. An area density of the plurality of supporters in the second region is in a range of from about 50% to about 100% to an area density of the plurality of first real conductive pillars in the first region. A method for manufacturing a semiconductor package including the semiconductor device is also disclosed in the present disclosure.
Claims20
A semiconductor device, comprising:
- a semiconductor die having a surface;
- a first real conductive pillar in a first region on the surface;
- a supporter in a second region adjacent to the first region;
- and
- a conductive wiring layer electrically coupled to the first real conductive pillar.
A semiconductor package, comprising:
- a first semiconductor die having a surface;
- a first real conductive pillar in a first region on the surface;
- a supporter in a second region adjacent to the first region;
- a second semiconductor die over the first semiconductor die;
- and
- a first conductive wiring layer between the first semiconductor die and the second semiconductor die.
Dependencies are inferred from the claim text.