Coreless organic packages with embedded die and magnetic inductor structures

An electronic device comprising:

• one or more processor cores;
• memory;
• and
• a memory controller, wherein
• at least one of the one or more processor cores, memory, or memory controller includes a coreless semiconductor package comprising:
• a plurality of dielectric layers;
• a magnetic inductor at least partly embedded within a first group of the plurality of layers;
• an interconnect bridge adjacent the magnetic inductor, the interconnect bridge embedded within a second group of the plurality of layers;
• a plurality of vias and interconnections in the plurality of layers, configured to connect a die of the interconnect bridge to other circuitry;
• a first level interconnect (FLI) on a first side of the package, the FLI configured to connect to at least some of the plurality of vias and interconnections;
• and
• a plurality of conductive ball grid array (BGA) pads on a second side of the package opposite the first side of the package.

A method of forming a coreless semiconductor package, the method comprising:

• providing a peelable core;
• forming, by using a photolithographic process, a coreless plurality of multi-element conductive layers on the peelable core, the multi-element conductive layers formed in a pattern of a BGA;
• forming on the plurality of multi-element convictive layers a plurality of dielectric layers;
• embedding a first magnetic material at least partly within a first group of the plurality of layers;
• embedding an interconnect bridge adjacent the first magnetic material, the interconnect bridge embedded within a second group of the plurality of layers;
• forming in the plurality of layers a plurality of vias and interconnections configured to connect a die of the interconnect bridge to other circuitry;
• forming an FLI on a first side of the package, the FLI configured to connect to at least some of the plurality of vias and interconnections;
• depaneling the peelable core;
• and
• forming from the plurality of multi-element conductive layers a plurality of pockets and conductive pads on a second side of the package opposite the first side of the package.