Semiconductor device having a translation feature and method therefor

A method of manufacturing a semiconductor device, the method comprising:

• forming an assembly comprising:
• placing a semiconductor die and a launcher structure on a package substrate, the launcher structure including:
• a launcher substrate having a first major surface and a second major surface;
• a launcher portion formed from a conductive layer at the first major surface;
• a translation pad formed from the conductive layer at the first major surface, the translation pad separate from the launcher portion;
• and
• forming a translation feature on the translation pad, the translation feature configured for alignment of a waveguide structure.

A semiconductor device comprising:

• an assembly comprising:
• a package substrate;
• a semiconductor die attached to the package substrate;
• a launcher structure attached to the package substrate, the launcher structure including:
• a launcher substrate having a first major surface and a second major surface;
• a launcher portion formed from a conductive layer at the first major surface;
• a translation pad formed from the conductive layer at the first major surface, the translation pad separate from the launcher portion;
• a translation feature formed on the translation pad;
• and
• an encapsulant encapsulating at least a portion of the semiconductor die and the launcher structure.