Semiconductor structure and method for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMENG-PEI LU, SHIN-YI YANG, SHU-WEI LI, CHIN-LUNG CHUNG, MING-HAN LEE
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMENG-PEI LU, SHIN-YI YANG, SHU-WEI LI, CHIN-LUNG CHUNG, MING-HAN LEE
Estimating the term…
A semiconductor structure includes a substrate, a plurality of conductive features disposed over the substrate, and an isolation structure between conductive features and separating the conductive features from each other. Each of the conductive features includes a first metal layer and a 2D material layer. Another semiconductor structure includes a first conductive feature, a dielectric structure over the first conductive feature, a second conductive feature in the dielectric structure and coupled to the first conductive feature, and a conductive line over and coupled to the second conductive feature. In some embodiments, the conductive line includes a first 3D material layer, a first 2D material layer, and a second 3D material layer. The first 2D material layer is disposed between the first 3D material layer and the second 3D material layer.
A semiconductor structure comprising:
A semiconductor structure, comprising:
17-20. (canceled)
A semiconductor structure comprising:
Dependencies are inferred from the claim text.