Electronic Device Having Inverted Lead Pins

An electronic device, comprising:

• a package having a longitudinal center line, a mounting portion on one side of the longitudinal center line and a non-mounting portion on an opposite side of the longitudinal center line;
• a die attach pad embedded in the mounting portion of the package, the die attach pad having a first side facing toward the longitudinal center line and a second side facing away from the longitudinal center line;
• a die attached to the first side of the die attach pad;
• and
• a plurality of lead pins extending from the package in a direction toward the mounting portion and away from the non-mounting portion of the package.

An electronic device, comprising:

• a package having a longitudinal center line, a mounting portion on one side of the longitudinal center line and a non-mounting portion on an opposite side of the longitudinal center line;
• a die attach pad embedded in the mounting portion of the package, the die attach pad having a first side facing toward the longitudinal center line and a second side facing away from the longitudinal center line;
• a die attached to the first side of the die attach pad;
• a plurality of lead pins extending from the package in a direction toward the mounting portion and away from the non-mounting portion of the package;
• a power enhancing device attached to the die attach pad, wherein the power enhancing device increases power supplied to the die attach pad;
• and
• a plurality of lead pins extending from the package in the direction toward the mounting portion and away from the non-mounting portion of the package.

An integrated circuit, comprising:

• a package having a longitudinal center line extending from one side of the package to another side;
• a die attach pad embedded in the package, the die attach pad having a first side facing toward the longitudinal center line and a second side facing away from the longitudinal center line, the die attach pad being displaced at a first offset from the longitudinal center line;
• a die attached to the first side of the die attach pad;
• and
• a plurality of lead pins extending from the package in a direction away from the longitudinal center line and opposite a direction of the first offset.

An integrated circuit, comprising:

• a package having a longitudinal center line extending from a first side of the package to a second side;
• a die attach pad embedded in the package, the die attach pad having a first side facing toward the longitudinal center line and a second side facing away from the longitudinal center line, the die attach pad being displaced at a first offset from the longitudinal center line;
• a die attached to the first side of the attach pad;
• a plurality of lead pins extending from the package in a direction away from the longitudinal center line and opposite a direction of the first offset;
• wherein the die attach pad includes an extended portion displaced at a second offset from the longitudinal center line of the package, and wherein a power enhancing device is attached to the extended portion of the die attach pad;
• and
• a plurality of lead pins extending from the package in the direction away from the longitudinal center line and opposite the direction of the first offset.

A method comprising:

• attaching a die to a die attach pad;
• attaching a first end of at least one lead pin to the die attach pad;
• placing the die in a cavity defined in a package body of an integrated circuit;
• encapsulating the die and the die attach pad in a package of the integrated circuit, wherein the die attach pad is displaced from a longitudinal center line of a package of the integrated circuit at a first offset in a direction toward a mounting portion of the package;
• and
• bending a second end of the at least one lead pin disposed outside the package in a direction away from the longitudinal center line of the package and opposite the direction of the first offset.

A method comprising:

• attaching a die to a die attach pad;
• attaching a first end of at least one lead pin to the die attach pad;
• placing the die in a cavity defined in a package body of an integrated circuit;
• encapsulating the die and the die attach pad in a package of the integrated circuit, wherein the die attach pad is displaced from a longitudinal center line of a package of the integrated circuit at a first offset in a direction toward a mounting portion of the package;
• and
• bending a second end of the at least one lead pin disposed outside the package in a direction away from the longitudinal center line of the package and opposite the direction of the first offset, wherein prior to bending a second end of the at least one lead pin, the method further includes removing the package from a mold.