Multi-chip package with extended frame

A computing device comprising:

• a printed circuit board;
• a package substrate coupled to the printed circuit board, the package substrate comprising:
• an interconnect frame extending beyond at least one side edge of the package substrate, the interconnect frame comprising a bottom surface positioned over and coupled to a top surface of the package substrate;
• a first semiconductor device positioned at least partially over and coupled to the interconnect frame;
• and
• a second semiconductor device positioned on the bottom surface of the interconnect frame alongside of the package substrate.

A method comprising:

• providing a package substrate;
• forming an interconnect frame;
• coupling a second semiconductor device to a bottom surface of the interconnect frame;
• coupling the interconnect frame to a top surface of the package substrate to position the second semiconductor alongside of the package substrate;
• and
• coupling a first semiconductor device to the top surface of the package substrate and to a portion of the interconnect frame.