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US 2022/0068775 A1Published application
Bending semiconductor chip for connection at different vertical levels
AssigneeInfineon Technologies AG
InventorsPaul WESTMARLAND, Stuart CARDWELL
Life of this patent
Estimating the term…
Abstract
A package is disclosed. In one example, the package comprises a carrier, a semiconductor chip having a first connection area at which the semiconductor chip is mounted at a first vertical level on or above the carrier, and a connection body. The semiconductor chip is bent to thereby be connected at a second connection area of the semiconductor chip at a second vertical level, being different from the first vertical level, with the connection body.
Claims19
A package, which comprises:
- a carrier;
- a semiconductor chip having a first connection area at which the semiconductor chip is mounted at a first vertical level on or above the carrier;
- and
- a connection body;
- wherein the semiconductor chip is bent to thereby be connected at a second connection area of the semiconductor chip at a second vertical level, being different from the first vertical level, with the connection body;
- and
- wherein the semiconductor chip comprises a first planar portion mounted on or above the carrier, a second planar portion mounted on the connection body, and a slanted and/or curved portion between the first planar portion and the second planar portion.
4 more elements
A method of manufacturing a package, wherein the method comprises:
- mounting a semiconductor chip having a first connection area at a first vertical level on or above a carrier;
- and
- bending the semiconductor chip to thereby connect the semiconductor chip at a second connection area of the semiconductor chip at a second vertical level, being different from the first vertical level, with a connection body such that the semiconductor chip comprises a first planar portion mounted on or above the carrier, a second planar portion mounted on the connection body, and a slanted and/or curved portion between the first planar portion and the second planar portion.
Dependencies are inferred from the claim text.