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US 2022/0068774 A1Published application
Semiconductor device package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorShih-Wen LU
Life of this patent
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Abstract
A semiconductor device package includes a substrate and a conductive lid. The conductive lid is disposed within the substrate. The conductive lid defines a waveguide having a cavity. The waveguide is configured to transmit a signal from a first electronic component to a second electronic component through the cavity.
Claims21
A semiconductor device package, comprising:
- a substrate;
- and
- a conductive lid disposed within the substrate,
- wherein the conductive lid defines a waveguide having a cavity, and
- wherein the waveguide is configured to transmit a signal from a first electronic component to a second electronic component through the cavity.
2 more elements
9-17. (canceled)
Dependencies are inferred from the claim text.