Power module
AssigneesHyundai Motor Company, Kia Corporation
InventorsTae Hwa Kim, Myung Ill You, Jin Myeong Yang
Life of this patent
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Abstract
A power module includes a power semiconductor device, a first power lead electrically connected to a first power terminal of the power semiconductor device, a second power lead disposed in parallel to the first power lead near the first power lead and electrically connected to a second power terminal of the power semiconductor device, and a conductive plate disposed to be spaced apart from the first power lead or the second power lead by a predetermined distance such that a region overlapping with the first power lead or the second power lead is formed.
Claims11
A power module comprising:
- a power semiconductor device having a first power terminal and a second power terminal;
- a first power lead electrically connected to the first power terminal of the power semiconductor device;
- a second power lead disposed in parallel to the first power lead and near the first power lead, the second power lead being electrically connected to the second power terminal of the power semiconductor device;
- and
- a conductive plate spaced apart from the first power lead or the second power lead by a predetermined distance, such that a region overlapping with the first power lead or the second power lead is formed.
Dependencies are inferred from the claim text.