Thermal Coupling Between Transistor And Audio Drivers With Heat Sink

Abstract

The invention refers to the thermal coupling between the SMD transistor/audio driver and a heat sink, wherein said thermal coupling consists of placing, below the SMD transistor or audio driver, a plate with thermal conductive material core capable of eliminating deficiencies of the state of the art. The SMD transistor or audio driver (1) is welded directly to the top of the plate with thermal conductive material core (2), which promotes heat transfer to a heat sink (3) that is welded directly to the bottom of the plate with thermal conductive material core. This design provides an optimal heat transfer, since the transistor or audio driver (1) is welded directly, through an oven weld remelting process, to a highly thermally conductive material. The transistors and drivers are welded directly to the plate through a highly thermally conductive dielectric material used in its construction, the installation of the plate with thermal conductive material core in the sink is facilitated, as it eliminates the need to employ electrical insulators and fasteners such as screws and clamps.

Dependencies are inferred from the claim text.