Electronic power package and heat sink/cold rail arrangement
AssigneeDelphi Technologies IP Limited
InventorsBinghua PAN, Wai Kwan WONG, David W. IHMS
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Abstract
An automotive power package includes a heat sink layer fabricated onto at least one surface of the automotive power package. The heat sink layer includes a material having a thermal conductivity higher than 130 W/m-K and a coefficient of thermal expansion between 5 and 15 ppm/° C.
Claims20
An automotive power package including a heat sink layer fabricated onto at least one surface of said automotive power package, said heat sink layer comprising a material having a thermal conductivity higher than 130 W/m-K, and a coefficient of thermal expansion between 5 and 15 ppm/° C.
A method of fabricating an automotive power package and heat sink arrangement comprising the step of:
- a) fabricating a heat sink layer onto at least one surface of said power package, said heat sink layer comprising a material having a thermal conductivity greater than 130 W/m-K and a coefficient of thermal expansion between 5 and 15 ppm/° C.
A method as claimed in claim, 12 including providing a thin layer of bonding or thermal interface material between said automotive power package and said heat sink layer.
Dependencies are inferred from the claim text.