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US 2022/0068751 A1Published application
Semiconductor Structure
AssigneeChangxin Memory Technologies, Inc.
InventorsJie LIU, Lixia ZHANG, Zhan YING
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Abstract
Embodiments of the present application provide a semiconductor structure that comprises a semiconductor substrate having a first surface and a second surface opposite to the first surface, a solder pad located at the first surface, a heat transfer layer located at the first surface and being in contact with the solder pad, and a groove located in the semiconductor substrate and being connected to the heat transfer layer.
Claims20
A semiconductor structure, comprising:
- a semiconductor substrate, having a first surface and a second surface opposite to the first surface;
- a solder pad, located at the first surface;
- a heat transfer layer, located at the first surface and being in contact with the solder pad;
- and
- a groove, located in the semiconductor substrate and being connected to the heat transfer layer.
2 more elements
Dependencies are inferred from the claim text.