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US 2022/0068747 A1Published application
Semiconductor package structure and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYu-Che HUANG, Lu-Ming LAI, Ying-Chung CHEN
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Abstract
A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package device, a first constraint structure and a second constraint structure. The first constraint structure is connected to the semiconductor package device. The second constraint structure is connected to the semiconductor package device and under a projection of the semiconductor package device.
Claims21
An electronic device, comprising:
- a semiconductor package device;
- a substrate;
- a first constraint structure electrically connecting the semiconductor package device and the substrate;
- and
- a second constraint structure connecting the semiconductor package device and the substrate, wherein the second constraint structure is under a projection of the semiconductor package device.
2 more elements
A semiconductor package structure, comprising:
- a semiconductor package device;
- an electronic structure connected to the semiconductor package device;
- and
- a support structure connected to the semiconductor package device, the support structure comprising:
- a substrate core layer;
- and
- a metal layer formed on the substrate core layer, wherein a first surface of the electronic structure is substantially coplanar with a first surface of the support structure.
4 more elements
18-20. (canceled)
Dependencies are inferred from the claim text.