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US 2022/0068744 A1Published application
Coated semiconductor dies
AssigneeTexas Instruments Incorporated
InventorsMichael Todd WYANT, Matthew John SHERBIN, Christopher Daniel MANACK, Patrick Francis THOMPSON, You Chye HOW
Life of this patent
Estimating the term…
Abstract
In examples, a chip scale package (CSP) comprises a semiconductor die; a conductive terminal coupled to the semiconductor die; and a non-conductive coat covering a backside of the semiconductor die and a sidewall of the semiconductor die. The non-conductive coat has a thickness of less than 45 microns.
Claims23
A chip scale package (CSP), comprising:
- a semiconductor die;
- a conductive terminal coupled to the semiconductor die;
- and
- a non-conductive coat covering a backside of the semiconductor die and a sidewall of the semiconductor die, the non-conductive coat having a thickness of less than 45 microns.
1 more element
A method, comprising:
- coupling a surface of a semiconductor wafer to a dicing tape, the surface opposite an active surface of the semiconductor wafer;
- singulating the semiconductor wafer to produce a semiconductor die;
- removing the semiconductor die from the dicing tape;
- and
- covering at least a portion of each of five surfaces of the semiconductor die with a non-conductive coat using a spray technique or an immersion technique.
2 more elements
A semiconductor package, comprising:
- a semiconductor die having a backside and a sidewall;
- and
- a metal coat covering the backside,
- wherein the sidewall lacks mechanical saw dicing grooves and laser dicing cracks.
1 more element
A method, comprising:
- mounting a semiconductor wafer to a carrier plate;
- laser dicing the semiconductor wafer to produce a semiconductor die;
- grinding a backside of the semiconductor die;
- covering the backside with a metal coat;
- mounting the semiconductor die to a tape;
- separating the semiconductor die and the carrier plate;
- and
- stretching the tape to separate the metal coat from another metal coat of another semiconductor die.
5 more elements
A method, comprising:
- positioning an active surface of a semiconductor wafer on a backgrind tape;
- laser dicing the semiconductor wafer;
- performing a grinding process on a backside of the semiconductor wafer;
- stretching the backgrind tape to separate a semiconductor die of the semiconductor wafer from another semiconductor die of the semiconductor wafer;
- and
- plating a metal coat between the semiconductor die and the another semiconductor die and on a backside of the semiconductor die.
3 more elements
Dependencies are inferred from the claim text.