Semiconductor module

A semiconductor module, comprising:

• a substrate having a semiconductor element thereon;
• a case having a frame that surrounds the substrate and a terminal block formed extending inward from an inner wall surface of the frame;
• a terminal having one end extending outward from the frame, and an other end extending inward from the frame and being secured to a top face of the terminal block;
• a wiring member that electrically connects the terminal and the semiconductor element on the substrate;
• and
• an encapsulating resin that encapsulates the other end of the terminal, the wiring member, and the semiconductor element inside the case;
• a base on which the case is disposed;
• and
• an adhesive that sticks the frame to the base, wherein
• the terminal block has a hole formed therein so as to penetrate through from a first surface of the terminal block in contact with the encapsulating resin to a second surface of the terminal block in contact with the adhesive, and
• the hole
• opens at one end into the first surface of the terminal block, and at an opposite end into the second surface of the terminal block, and
• is filled with the encapsulating resin from the one end and is filled with the adhesive from the opposite end.