Wafer inspection apparatus and system including the same

A system comprising:

• a wafer processing apparatus;
• and a wafer inspection apparatus, wherein the wafer inspection apparatus includes:
• a first input optical system configured to irradiate a first input beam onto a wafer;
• a second input optical system configured to irradiate a second input beam onto the wafer;
• an objective lens configured to overlap the first and second input beams on a portion of the wafer;
• and
• an image sensor configured to generate an image of the wafer based on nonlinear scattered light generated from the portion of the wafer based on the first and second input beams,
• wherein paths of the first and second input beams are each spaced apart from an optical axis of the objective lens.

A wafer inspection apparatus comprising:

• a first input optical system configured to emit a first input beam to a wafer;
• a second input optical system configured to emit a second input beam to the wafer;
• an objective lens configured to overlap the first and second input beams on a portion of the wafer;
• and
• an image sensor configured to generate an image of the wafer based on nonlinear scattered light generated from the portion of the wafer based on the first and second input beams.