US 2022/0068680 A1 · CHIP MATCHING SYSTEM AND METHOD THEREOF

Abstract

A chip matching system and a corresponding method are provided. The method defines a plurality of first electronic components in a first wafer as various grades of chips and defines a plurality of second electronic components in a second wafer as various grades of chips, and then grades of the first electronic components and the second electronic components are matched to generate target information, and finally the first and second electronic components are integrated in the same position according to the target information. Therefore, the highest-grade chips can be arranged in a multi-chip module to optimize the quality of the multi-chip module.

Claims11

Dependent claims

A chip matching system, comprising:

a first picking device configured for moving a plurality of first electronic components of different grades defined by a first wafer;
a second picking device configured for moving a plurality of second electronic components of different grades defined by a second wafer;
and
a calculation module communicatively connected to the first picking device and the second picking device to perform a grade matching between the first electronic components and the second electronic components to generate target information, wherein the first picking device and the second picking device integrate at least one of the first electronic components and at least one of the second electronic components in one position based on the target information.

1 more element

Dependencies are inferred from the claim text.

Chip matching system and method thereof

Life of this patent

Chip matching system and method thereof

Life of this patent

Abstract

Claims11