Systems and methods for integrating load locks into a factory interface footprint space

An electronic device manufacturing system, comprising:

• a transfer chamber;
• a plurality of processing chambers connected to the transfer chamber;
• a first load lock having a first side and a second side that is approximately perpendicular to the first side of the first load lock, wherein the first side of the first load lock is connected to the transfer chamber;
• a second load lock having a first side and a second side that is approximately perpendicular to the first side of the second load lock, wherein the first side of the second load lock is connected to the transfer chamber;
• a first factory interface connected to the second side of the first load lock;
• and
• a second factory interface connected to the second side of the second load lock.

A method for transporting substrates from a first factory interface robot to a second factory interface robot, comprising:

• retrieving, by a first factory interface robot, a substrate from a substrate carrier;
• transferring the substrate from the first factory interface robot to a second factory interface robot, wherein the first factory interface robot and the second factory interface robot are disposed within a factory interface;
• and
• placing the substrate, via the second factory interface robot, inside a load lock disposed within the factory interface.