Back to results
US 2022/0068675 A1Published application
Epi chamber with full wafer laser heating
AssigneeApplied Materials, Inc.
InventorsShu-Kwan Danny LAU, Adel George TANNOUS, Patrick C. GENIS, Zhiyuan YE
Life of this patent
Estimating the term…
Abstract
An apparatus for heating a substrate within a thermal processing chamber is disclosed. The apparatus includes a chamber body, a gas inlet, a gas outlet, an upper window, a lower window, a substrate support, and an upper heating device. The upper heating device is a laser heating device and includes one or more laser assemblies. The laser assemblies include light sources, a cooling plate, optical fibers, and irradiation windows.
Claims20
A chamber for substrate processing comprising:
- a chamber body;
- a gas inlet disposed through a sidewall of the chamber body;
- a gas outlet disposed through a sidewall of the chamber body and opposite the gas inlet;
- an upper window;
- a lower window;
- and
- an upper heating device, the upper heating device further comprising:
- an upper cooling plate;
- one or more upper base members disposed on the upper cooling plate;
- one or more upper light sources;
- one or more optical fibers connected to the one or more upper light sources at a first end and the upper base member at a second end;
- and
- an irradiation window disposed within the upper base member and between the one or more optical fibers and the upper window.
10 more elements
A chamber for substrate processing comprising:
- a chamber body;
- a gas inlet disposed through a sidewall of the chamber body;
- a gas outlet disposed through a sidewall of the chamber body and opposite the gas inlet;
- an upper window;
- a lower window;
- an upper heating device, the upper heating device further comprising:
- an upper cooling plate with a one or more openings disposed therethrough;
- one or more upper base members disposed on the upper cooling plate;
- one or more upper light sources;
- one or more optical fibers connected to the one or more upper light sources and the upper base member;
- and
- an irradiation window disposed within the upper base member and between the one or more optical fibers and the upper window;
- and
- a lower heating device.
11 more elements
A chamber for substrate processing comprising:
- a chamber body;
- a gas inlet disposed through a sidewall of the chamber body;
- a gas outlet disposed through a sidewall of the chamber body and opposite the gas inlet;
- an upper window;
- a lower window;
- a substrate support disposed between the upper window and the lower window;
- an upper heating device, the upper heating device further comprising:
- an upper cooling plate with a one or more openings disposed therethrough;
- one or more upper base members disposed on the upper cooling plate;
- one or more upper light sources;
- one or more optical fibers connected to the one or more upper light sources and the upper base member, wherein a divergent laser is supplied by the one or more upper light sources to the optical fibers;
- and
- an irradiation window disposed within the upper base member and between the one or more optical fibers and the upper window;
- and
- a lower heating device.
12 more elements
Dependencies are inferred from the claim text.