Substrate cleaning apparatus, substrate processing apparatus, substrate cleaning method, device manufacturing method, and non-transitory computer readable medium

A substrate cleaning apparatus, comprising:

• a holding portion having a bearing portion that rotatably holds a cleaning member for cleaning a substrate;
• a first supply portion that is at least partially arranged inside the holding portion and supplies a first liquid into the cleaning member through the inside of the holding portion;
• and
• a second supply portion that supplies a second liquid to the bearing portion;
• wherein the holding portion is equipped with a discharge port for discharging the liquid from the inside of the holding portion, and
• the substrate cleaning apparatus comprises a control portion that controls a supply flow volume of the first liquid based on a drainage amount signal of the drainage discharged from the discharge port.

A substrate processing apparatus, comprising:

• a substrate polishing apparatus that polishes a substrate;
• and
• a substrate cleaning apparatus that cleans the substrate after polishing;
• wherein the substrate cleaning apparatus comprises:
• a holding portion having a bearing portion that rotatably holds a cleaning member for cleaning the substrate;
• a first supply portion that is at least partially arranged inside the holding portion and supplies a first liquid into the cleaning member through the inside of the holding portion;
• and
• a second supply portion that supplies a second liquid to the bearing portion;
• the holding portion is equipped with a discharge portion that has a discharge port for discharging the liquid accumulated inside the holding portion, and
• the discharge portion is equipped with a flow meter that measures a flow volume of the liquid discharged from the discharge port.

A substrate processing apparatus, comprising:

• a substrate polishing apparatus that polishes a substrate;
• and
• a substrate cleaning apparatus that cleans the substrate after polishing;
• wherein the substrate cleaning apparatus comprises:
• a holding portion having a bearing portion that rotatably holds a cleaning member for cleaning the substrate;
• a first supply portion that is at least partially arranged inside the holding portion and supplies a first liquid into the cleaning member through the inside of the holding portion;
• and
• a second supply portion that supplies a second liquid to the bearing portion;
• the holding portion is equipped with a discharge portion that has a discharge port for discharging the liquid from the inside of the holding portion, and
• the substrate cleaning apparatus comprises a control portion that controls a supply flow volume of the first liquid based on a drainage amount signal of the drainage discharged from the discharge port.

A substrate cleaning method, the substrate cleaning method comprises;

• a step of providing a substrate cleaning apparatus, wherein
• the substrate cleaning apparatus comprises:
• a holding portion having a bearing portion that rotatably holds a cleaning member for cleaning a substrate;
• a first supply portion that is at least partially arranged inside the holding portion and supplies the first liquid into the cleaning member through the inside of the holding portion;
• and
• a second supply portion that supplies a second liquid to the bearing portion;
• the holding portion is equipped with a discharge portion that has a discharge port for discharging the liquid accumulated inside the holding portion, and
• the discharge portion is equipped with a flow meter that measures a flow volume of the liquid discharged from the discharge port;
• a step of cleaning a substrate, while supplying the first liquid into the cleaning member;
• a step of measuring and acquiring the flow volume of the drainage by the flow meter;
• and
• a step of, initiating the control of the supply flow volume of the first liquid based on the change, the change occurs when the flow volume of the drainage measured by the flow meter changes with respect to the supply flow volumes of the first liquid and the second liquid.

A substrate cleaning method of continuously cleaning a plurality of substrates, comprising:

• a step in which a cleaning member is rotatably held by a bearing portion that is included in a holding portion, the cleaning member having a flow path therein;
• and
• a step in which processing for bringing the cleaning member into contact with the substrate while rotating the cleaning member to clean the substrate is performed on the plurality of substrates;
• wherein the substrate cleaning method comprises the following steps (1) to (4):
• (1) providing a first supply portion and a discharge portion, the first supply portion and the discharge portion are included in the holding portion,
• and supplying a first liquid to the inside of the holding portion through the first supply portion of the holding portion, thereby introducing the first liquid into the flow path of the cleaning member, and discharging the liquid accumulated inside from the discharge portion that has a discharge port, and the first liquid is supplied into the cleaning member from the first supply portion inside the holding portion;
• (2) supplying a second liquid for cooling and lubricating the bearing portion from the second supply portion to the bearing portion;
• (3) measuring the flow volume of the drainage discharged from the discharge port by a flow meter arranged in the discharge portion;
• and
• (4) when the flow volume of the drainage measured by the flow meter exceeds a predetermined threshold value, generating a control signal for changing a supply flow volume of the first liquid from the first supply portion in a manner that the flow volume of the drainage becomes equal to or less than the predetermined threshold value.