Method of manufacturing semiconductor device

A method of manufacturing a semiconductor device comprising the steps of:

• loading a substrate into a semiconductor manufacturing apparatus including:
• a loader unit into which the substrate is loaded, the substrate including a plurality of device regions each including a plurality of terminals formed on a main surface and a semiconductor chip mounted on the main surface and electrically connected to the terminal by a wire;
• a substrate delivery unit delivering the substrate;
• a plasma generating unit arranged so as to face the main surface of the substrate and generating plasma in atmosphere;
• a recognition camera arranged so as to face the main surface of the substrate and capturing images of the substrate, the semiconductor chip and the wire;
• and a molding unit forming a sealing body by sealing the semiconductor chip and the wire with a resin;
• delivering the substrate from the loader unit to the recognition camera by using the substrate delivery unit in a state in which the main surface of the substrate faces downward, and at the same time, emitting the plasma to the region of the main surface of the substrate by using the plasma generating unit;
• delivering the substrate from the plasma generating unit to the molding unit by using the substrate delivery unit in the state in which the main surface of the substrate faces downward, and at the same time, capturing an image of the region of the main surface of the substrate by using the recognition camera;
• and
• forming a sealing body by sealing the semiconductor chip and the wire with a resin in the state in which the main surface of the substrate faces downward.