US 2022/0066096 A1 · CAVITY SUBSTRATE HAVING DIRECTIONAL OPTOELECTRONIC TRANSMISSION CHANNEL AND MANUFACTURING METHOD THEREOF

Abstract

A cavity substrate may have a directional optoelectronic transmission channel. The cavity substrate includes a support frame, a first dielectric layer on a first surface of the support frame, and a second dielectric layer on a second surface of the support frame. The support frame, the first dielectric layer and the second dielectric layer constitute a closed cavity having an opening on one side in the length direction of the substrate, a first circuit layer is arranged on the inner surface of the first dielectric layer facing the cavity, an electrode connected with an optical communication device is arranged on the first circuit layer, the electrode is electrically conducted with the first circuit layer, a second circuit layer is arranged on the outer surfaces of the first dielectric layer and the second dielectric layer, and the first circuit layer and the second circuit layer are communicated through a via column.

Claims20

Dependent claims

A cavity substrate having a directional optoelectronic transmission channel, the cavity substrate comprising:

a support frame;
a first dielectric layer located on a first surface of the support frame;
and
a second dielectric layer located on a second surface of the support frame,
wherein the support frame, the first dielectric layer and the second dielectric layer constitute a closed cavity having an opening on one side in a length direction of the substrate, a first circuit layer is arranged on an inner surface of the first dielectric layer facing the cavity, at least one electrode connected with an optical communication device is arranged on the first circuit layer, the electrode is electrically conducted with the first circuit layer, a second circuit layer is arranged on outer surfaces of the first dielectric layer and the second dielectric layer, and the first circuit layer and the second circuit layer are communicated through a via column.

2 more elements

A method for manufacturing a cavity substrate having a directional optoelectronic transmission channel, the method comprising:

(a) preparing a support frame, wherein the support frame comprises an insulating layer, a via column penetrating through the insulating layer in a thickness direction, and a cavity surrounded by the insulating layer;
(b) applying an adhesive layer on a first surface of the support frame, and mounting an active metal block on the adhesive layer exposed in the cavity, wherein the active metal block comprises an electrode coated with etching-resistant metal at a bottom of the active metal block;
(c) laminating a second dielectric layer on a second surface of the support frame to fill a gap of the cavity;
(d) removing the adhesive layer;
(e) forming a first circuit layer on the first surface of the support frame, and connecting the electrode to the first circuit layer;
(f) laminating a first dielectric layer on the first circuit layer;
(g) forming a second circuit layer on outer surfaces of the first dielectric layer and the second dielectric layer;
(h) removing dielectric in the cavity to expose the active metal block;
(i) etching the active metal block and an etching-resistant metal coating the electrode;
and
(j) cutting along a scribe line of the support frame to obtain the cavity substrate having a directional optoelectronic transmission channel.

8 more elements

Dependencies are inferred from the claim text.

Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof

Life of this patent

Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof

Life of this patent

Abstract

Claims20