Method of electroplating stress-free copper film

A stress-free electroplated copper film comprising:

• a thickness of 2 to 200 μm;
• a first internal stress of about −0.08 to 0.20 MPa, the first internal stress being measured within 1 hour after electroplating the stress-free electroplated copper film on a substrate;
• a second internal stress of about 0.08 to 0.12 MPa, the second internal stress being measured 24 hours after electroplating or annealed at 60 to 120° C. for 0.5 to 2 hours;
• an impurity of 20 to 120 ppm;
• and
• an X-ray powder diffraction pattern having an I(111):I(200):I(220) intensity ratio of about 100:9.5:3.7 or 27:2.5:1.

A stress-free electroplated copper film comprising:

• a thickness of 2 to 200 μm;
• a first internal stress of about −4.0 to 4.0 MPa, the first internal stress being measured within 1 hour after electroplating the stress-free electroplated copper film on a substrate;
• a second internal stress of about 0.08 to 0.12 MPa, the second internal stress being measured after electroplating and annealed at 60-120° C. for 0.5 to 2 hours;
• an impurity of 1 to 4 ppm;
• and
• an X-ray powder diffraction pattern having an I(111):I(200):I(220) intensity ratio of about 100:7:7 or 14.3:1:1.