Sputtering system and deposition method

A deposition method for depositing a film on a substrate utilizing a sputtering system, wherein the sputtering system comprises at least two sputtering chambers, each of the at least two sputtering chambers comprises a plurality of targets separated from each other and a plurality of target pedestals, each of the plurality of targets is mounted on a corresponding target pedestal of the plurality of target pedestals, and a gap between two adjacent targets of the plurality of targets has a width sufficient to accommodate at least one of the plurality of targets,

• the deposition method comprises:
• mounting the plurality of targets of same material on a predetermined number of target pedestals in the at least two sputtering chambers, wherein the gap between two adjacent targets of the plurality of targets has a width sufficient to accommodate at least one of the plurality of targets;
• and
• delivering the substrate into the at least two sputtering chambers sequentially and performing a sputtering deposition process to the substrate, wherein starting from a second one of the at least two sputtering chambers, a recessed region of an intermediate film on the substrate is opposite to a plurality of targets in a current sputtering chamber of the at least two sputtering chambers where a sputtering deposition process is to be performed.