Ultrasonic bonding apparatus and method for ultrasonic bonding using the same

A method for ultrasonic bonding, the method comprising:

• providing a display panel on a stage including an upper surface on a plane defined by a first direction and a second direction crossing the first direction;
• fixing an electronic component to a head part spaced apart from the stage in a third direction crossing the first direction and the second direction;
• having the display panel and the electronic component into contact with each other;
• and
• bonding the display panel and the electronic component to each other,
• wherein the bonding the display panel and the electronic component comprises:
• providing a first vibration vibrating in a direction parallel to the first direction to a contact surface between the display panel and the electronic component;
• and
• providing a second vibration vibrating in a direction parallel to the third direction to the contact surface.