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US 2022/0049082 A1Published application
Resin composition and molded body thereof
AssigneeKurarayco., Ltd.
InventorsYusuke AMANO, Eiichi ISHIDA, Masayoshi YAMANAKA, Kazuhiko MAEKAWA
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Abstract
The present invention provides a resin composition having superior flexibility and that exhibits excellent durability in thermal molding, and a molded body of such a resin composition. The present invention relates to a resin composition comprising: a copolymer (B) constituted of a vinyl alcohol polymer (B-1) region and a diene polymer (B-2) region; and at least one compound selected from the group consisting of a phenol-based compound (C), an amine-based compound (D), and a phosphorus-based compound (E).
Claims19
A resin composition comprising:
- a copolymer (B) constituted of a vinyl alcohol polymer (B-1) region and a diene polymer (B-2) region;
- and
- at least one compound selected from the group consisting of a phenol-based compound (C), an amine-based compound (D), and a phosphorus-based compound (E).
Dependencies are inferred from the claim text.