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US 2022/0046804 A1Published application
Coating agent and method for manufacturing electronic module using the coating agent
AssigneeSekisui Chemical Co., Ltd.
InventorsSatoru KUROZUMI, Masao INOUE
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Abstract
The present invention is to provide a coating agent that can form a coated layer having uniform heat insulating properties and suppress the electronic component from being damaged due to partial re-melting of solder or thermal expansion of the resin. The coating agent according to the present invention comprises (A) a thermoplastic resin, (B) an organic solvent, (C) a thixotropic agent, and (D) hollow particles.
Claims7
A coating agent comprising:
- (A) a thermoplastic resin,
- (B) an organic solvent,
- (C) a thixotropic agent, and
- (D) a hollow particle.
1 more element
Dependencies are inferred from the claim text.