Circuit board and method for manufacturing the same

A method for manufacturing a circuit board, comprising:

• providing a base layer;
• forming two first photosensitive resin layers on opposite surfaces of the base layer, each first photosensitive resin layer comprising a photosensitive resin and a conductive material disposed in the photosensitive resin, each first photosensitive resin layer being divided into a first portion and a second portion beside the first portion;
• treating the first portion through an exposure process;
• removing the second portion through a development process, thereby obtaining a first bottom wiring, each first bottom wiring comprising a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end;
• and
• forming a first electroplated copper wiring on the second end and the first sidewall of each first bottom wiring, and each first bottom wiring and the corresponding first electroplated copper wiring cooperatively forming a first wiring layer.