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US 2022/0046800 A1Published application
Wiring board and method of manufacturing wiring board
AssigneeShinko Electric Industries Co., Ltd.
InventorNaohiro Mashino
Life of this patent
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Abstract
A wiring board includes an insulating layer; an insulating oxide film that is formed by forming a film of metal oxide or semimetal oxide on a surface of the insulating layer; a seed layer that is made of metal and that is stacked on the insulating oxide film; and an electrode that is made of metal and that is formed on the seed layer, wherein the insulating oxide film and the seed layer are removed from an area not overlapping the electrode to expose the insulating layer.
Claims7
A wiring board comprising:
- an insulating layer;
- an insulating oxide film that is formed by forming a film of metal oxide or sew metal oxide on a surface of the insulating layer;
- a seed layer that is made of metal and that is stacked on the insulating oxide film;
- and
- an electrode that is made of metal and that is formed on the seed layer,
- wherein the insulating oxide film and the seed layer are removed from as area not overlapping the electrode to expose the insulating layer.
3 more elements
Dependencies are inferred from the claim text.