Multilayer resin substrate and electronic component

A multilayer resin substrate comprising:

• a plurality of insulating resin base material layers;
• and
• a plurality of conductor patterns on at least one of the plurality of insulating resin base material layers;
• wherein
• the plurality of conductor patterns include a planar conductor on a main surface of the plurality of insulating resin base material layers and extending into a frame shape or a planar shape;
• the planar conductor includes a plurality of openings;
• the plurality of openings include:
• a first opening group in which a plurality of openings are arranged at regular intervals;
• and
• a second opening group in which a plurality of openings located closer to an outer end of the planar conductor than the first opening group are arranged at regular intervals;
• and
• a first opening group area being a total of plane cross-sectional areas of the first opening group is larger than a second opening group area being a total of plane cross-sectional areas of the second opening group.

A multilayer resin substrate comprising:

• a plurality of insulating resin base material layers;
• and
• a plurality of conductor patterns on at least one of the plurality of insulating resin base material layers;
• wherein
• the plurality of conductor patterns include a planar conductor on a main surface of the plurality of insulating resin base material layers and extending into a frame shape or a planar shape;
• the planar conductor includes a plurality of openings;
• each of the plurality of openings, in a plan view, has a shape in which a width in a direction perpendicular or substantially perpendicular to a direction from an outer end of the planar conductor toward inside is increased from the outer end of the planar conductor toward the inside;
• and
• the plurality of openings are arranged at regular intervals.

An electronic component comprising:

• a plurality of insulating resin base material layers;
• and
• a plurality of conductor patterns on at least one of the plurality of insulating resin base material layers;
• wherein
• the plurality of conductor patterns include:
• a signal line;
• and
• a ground conductor that overlaps the signal line, when viewed in a stacking direction of the plurality of insulating resin base material layers and extends into a planar shape;
• the ground conductor includes a plurality of openings;
• and
• an aperture ratio of the plurality of openings in an outside portion of the ground conductor is less than an aperture ratio of the plurality of openings in an inside portion of the ground conductor.