Pre-Plating of Solder Layer on Solderable Elements for Diffusion Soldering
AssigneeInfineon Technologies AG
InventorsAlexander Heinrich, Alexander Roth
Life of this patent
Estimating the term…
Abstract
A pre-soldered circuit carrier includes a carrier having a metal die attach surface, a plated solder region on the metal die attach surface, wherein a maximum thickness of the plated solder region is at most 50 μm, the plated solder region has a lower melting point than the first bond pad, and the plated solder region forms one or more intermetallic phases with the die attach surface at a soldering temperature that is above the melting point of the plated solder region.
Claims21
A pre-soldered circuit carrier, comprising:
- a carrier comprising a metal die attach surface;
- and
- a plated solder region on the metal die attach surface;
- wherein a maximum thickness of the plated solder region is at most 50 μm,
- wherein the plated solder region has a lower melting point than the die attach surface, and
- wherein the plated solder region forms one or more intermetallic phases with the die attach surface at a soldering temperature that is above the melting point of the plated solder region.
A method of forming a pre-soldered element, the method comprising:
- providing a substrate comprising a first metal joining surface;
- depositing a mask material on the substrate that covers the first metal joining surface;
- patterning the mask material to form an opening that exposes the first metal joining surface;
- and
- performing a plating process that forms a plated solder region on a portion of the first metal joining surface that is exposed by the opening;
- wherein the plated solder region has a lower melting point than the first metal joining surface, and
- wherein the plated solder region forms one or more intermetallic phases with the first metal joining surface at a soldering temperature that is above the melting point of the plated solder region.
A method of soldering electronic components, the method comprising:
- providing a substrate comprising a first metal joining surface and a joining partner comprising a second metal joining surface, the substrate or the joining partner being pre-plated with a plated solder region;
- arranging the joining partner and the substrate together such that the plated solder region interfaces with the first metal joining surface and with the second metal joining surface;
- and
- performing a soldering step that forms a first soldered joint between the first and second metal joining surfaces and the plated solder region,
- wherein a maximum thickness of the plated solder region is at most 50 μm, and
- wherein the soldering step is performed at a soldering temperature that causes the plated solder region to melt and react with the first and second metal joining surfaces to form one or more intermetallic phases within the first soldered joint, each of the one or more intermetallic phases having a melting point above the plated solder region and the soldering temperature.
Dependencies are inferred from the claim text.