Dissipating heat from an electronic assembly using forced convection, and method for dissipating heat from an electronic assembly

An electronic assembly, comprising:

• a printed circuit board having a first component side and a second component side,
• a plurality of electronic components, with a majority of the electronic components disposed on the second component side,
• at least one first plated-through hole disposed in the printed circuit board and configured to transport thermal energy generated by an electronic component disposed on the second component side from the second component side to the first component side,
• a convection unit generating forced convection exclusively on the first component side, said convection unit transporting the generated thermal energy away from the printed circuit board so as to cool the electronic assembly, and
• at least one first cooling element disposed on the first component side and associated with a first electronic component disposed on the first component side or with a first electronic component disposed on the second component side, and
• at least one second cooling element disposed on the first component side and associated with a second electronic component disposed on the second component side,
• wherein the at least one first cooling element and the at least one second cooling element are connected to a first potential or to a second potential.

A method for dissipating heat from an electronic assembly which comprises a printed circuit board having a first component side and a second component side, the method comprising:

• transporting thermal energy from the second component side to the first component side by way of a plated-through hole disposed in the printed circuit board,
• cooling the second component side using natural convection, and
• cooling the first component side using forced convection to transport the thermal energy away from the printed circuit board and to thereby cool the electronic assembly,
• wherein at least one first cooling element is disposed on the first component side and associated with a first electronic component disposed on the first component side or with a first electronic component disposed on the second component side, and
• wherein at least one second cooling element is disposed on the first component side and associated with a second electronic component disposed on the second component side,
• the method further comprising
• connecting the at least one first cooling element and the at least one second cooling element to a first potential or to a second potential. cm 23. The method of claim 22, wherein the plated-through hole does not conduct electrical current.