Flexible circuit board for chip on film and chip package comprising the same, and electronic device comprising the same

A chip package comprising:

• a substrate including a first surface and a second surface opposite to the first surface and including a chip mounting region;
• a circuit pattern layer disposed on the first surface;
• a chip electrically connected to the circuit pattern layer;
• and
• a heat dissipation part disposed in the chip mounting region,
• wherein the substrate is formed with at least two or more holes that are formed in a region overlapping the heat dissipation part, and
• the heat dissipation part includes:
• a heat dissipation pattern layer disposed on the first surface;
• a connection layer disposed inside the hole;
• and
• a heat dissipation layer disposed on the second surface,
• wherein the heat dissipation pattern layer, the connection layer, and the heat dissipation layer are integrally formed.