Techniques for thermal management within optical subassembly modules and a heater device for laser diode temperature control

A laser submount for use within transmitter optical subassemblies (TOSAs) or transmitters, the laser submount comprising:

• a substrate;
• a laser diode (LD) coupled to the substrate;
• a first electrically conductive path disposed on the substrate to electrically couple the LD to LD driving circuitry;
• and
• a heater device disposed on the substrate, the heater device having a resistive heating element and an electrical conductor thermally coupled to each other, the electrical conductor configured to provide at least a portion of the first electrically conductive path to electrically couple the LD with the LD driving circuitry and configured to communicate heat from the resistive heating element to the LD, wherein the resistive heating element is electrically isolated from the electrical conductor.

An optical transceiver module, the optical transceiver module comprising:

• a housing;
• a transceiver substrate disposed at least partially within the housing;
• at least one transmitter optical subassembly (TOSA) assembly coupled to the transceiver substrate, the at least one TOSA assembly comprising:
• a laser submount;
• a laser diode (LD) coupled to the laser submount;
• a first electrically conductive path disposed on the laser submount to electrically couple the LD to LD driving circuitry;
• a heater device disposed on the laser submount, the heater device providing at least a portion of the first electrically conductive path and configured to communicate heat to the LD via one or more wire bonds;
• and
• a receiver optical subassembly (ROSA) arrangement coupled to the transceiver substrate.