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US 2022/0045264 A1Published application
Semiconductor module and method for manufacturing the same
AssigneeUnited Microelectronics Corp.
InventorZhi-Biao ZHOU
Life of this patent
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Abstract
A semiconductor module and a method for manufacturing the same are provided. The semiconductor module includes a substrate comprising a front side and at least one semiconductor device formed on the front side, a shielding structure formed on the at least one semiconductor device, and a piezoelectric layer formed on the shielding structure.
Claims21
A semiconductor module, comprising:
- a substrate comprising a front side and at least one semiconductor element formed on the front side;
- a shielding structure formed on the at least one semiconductor element;
- and
- a piezoelectric layer formed on the shielding structure.
1 more element
A method for manufacturing a semiconductor module, comprising:
- providing a substrate, wherein the substrate comprises a front side and at least one semiconductor element formed on the front side;
- forming a shielding structure on the at least one semiconductor element;
- and
- forming a piezoelectric layer on the shielding structure.
1 more element
Dependencies are inferred from the claim text.