A method for producing an optoelectronic semiconductor component, comprising:
- forming a semiconductor layer stack comprising a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type and an active zone, the active zone being arranged between the first and second semiconductor layers;
- patterning a mesa so that parts of the second semiconductor layer are free from the first semiconductor layer and a portion of the active zone is exposed in the area of a mesa flank;
- forming a passivation layer over parts of the first semiconductor layer, over parts of the second semiconductor layer and over the exposed portion of the active zone;
- forming a first metal layer electrically connected to the first semiconductor layer;
- forming a second metal layer electrically connected to the second semiconductor layer,
- wherein the second metal layer covers the passivation layer in the area of the mesa flank and a composition of the first metal layer adjacent to the first semiconductor layer is constant in a horizontal direction,
- wherein the first metal layer directly adjoins the first semiconductor layer and a lateral positioning of the first metal layer differs by less than 100 nm from the lateral positioning of the patterned first semiconductor layer.