Optoelectronic component and method for producing same
AssigneeOSRAM Opto Semiconductors GmbH
InventorsZeljko PAJKIC, Michael MÜLLER
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Abstract
The invention relates to an optoelectronic component comprising a carrier, an optoelectronic semiconductor chip arranged on the upper side of the carrier, and a frame which is arranged on the upper side of the carrier and which frames the optoelectronic semiconductor chip. An underside of the frame, which faces the upper side of the carrier, has at least one recess. In a spatial area framed by the frame on the upper side of the carrier, there is arranged a potting material which is in contact with the frame and at least partly fills the recess in the frame.
Claims20
An optoelectronic component
- having a carrier,
- having an optoelectronic semiconductor chip arranged on an upper side of the carrier,
- having a frame, which is arranged on the upper side of the carrier and borders the optoelectronic semiconductor chip,
- wherein a lower side, facing toward the upper side of the carrier, of the frame comprises at least one recess,
- wherein the lower side of the frame is fastened on the upper side of the carrier by means of an adhesive,
- and having an encapsulation material, which is arranged in a spatial region, bordered by the frame, on the upper side of the carrier, is in contact with the frame and at least partially fills the recess of the frame.
A method for producing an optoelectronic component, having the following steps:
- arranging an optoelectronic semiconductor chip on an upper side of a carrier;
- providing a frame having a lower side which comprises a recess;
- arranging the frame on the upper side of the carrier in such a way that the lower side of the frame faces toward the upper side of the carrier and the frame borders the optoelectronic semiconductor chip, the lower side of the frame being fastened on the upper side of the carrier by means of an adhesive;
- arranging an encapsulation material in a spatial region, bordered by the frame, on the upper side of the carrier in such a way that the encapsulation material is in contact with the frame and at least partially fills the recess of the frame.
Dependencies are inferred from the claim text.