Semiconductor device and method for fabricating the same
AssigneeUnited Microelectronics Corp.
InventorsChih-Kai Hsu, Ssu-I Fu, Yu-Hsiang Hung, Wei-Chi Cheng, Jyh-Shyang Jenq
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AssigneeUnited Microelectronics Corp.
InventorsChih-Kai Hsu, Ssu-I Fu, Yu-Hsiang Hung, Wei-Chi Cheng, Jyh-Shyang Jenq
Estimating the term…
A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a spacer around the gate structure; and forming a buffer layer adjacent to the gate structure. Preferably, the buffer layer includes a crescent moon shape and the buffer layer includes an inner curve, an outer curve, and a planar surface connecting the inner curve and an outer curve along a top surface of the substrate, in which the planar surface directly contacts the outer curve on an outer sidewall of the spacer.
A method for fabricating semiconductor device, comprising:
Dependencies are inferred from the claim text.