Interposer structure and method for manufacturing thereof
AssigneeAP Memory Technology Corp.
InventorWENLIANG CHEN
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Abstract
An interposer structure is provided. The interposer structure includes a plurality of interposer units in an array arrangement from a top view perspective. Each of the interposer units includes a first region and a plurality of second regions. The first region has a capacitor structure. Each of the plurality of second regions is free of the capacitor structure. The first region surrounds the plurality of second regions. A method for manufacturing an interposer structure is also provided.
Claims24
An interposer structure, comprising:
- a substrate portion;
- a wiring portion over the substrate portion;
- an interconnect portion over the wiring portion;
- a through via penetrating the substrate portion and the wiring portion;
- and
- a capacitor structure embedded in the wiring portion;
- wherein the interconnect portion comprises a first metal wire electrically coupled to the capacitor structure.
An interposer structure, comprising:
- a plurality of interposer units in an array arrangement from a top view perspective, each comprising:
- a first region having a capacitor structure;
- and
- a plurality of second regions, each being free of the capacitor structure, the first region surrounding the plurality of second regions.
A method for manufacturing an interposer structure, the method comprising:
- forming a wiring portion over a front side of a substrate portion;
- and
- forming a capacitor structure within the wiring portion during forming the wiring portion;
- wherein the capacitor structures are formed by a DRAM process.
Dependencies are inferred from the claim text.