Package structure and manufacturing method thereof

A manufacturing method of a package structure, comprising:

• providing a wafer, wherein the wafer comprises an active surface, and the active surface has a sensing area;
• forming a dam structure on the active surface of the wafer;
• disposing a light-transmitting sheet on the dam structure;
• forming a through silicon via on the wafer, and forming a circuit layer electrically connected to the through silicon via on a back surface of the wafer opposite to the active surface;
• forming a dielectric layer covering the through silicon via;
• forming a conductive connector on the dielectric layer;
• disposing a second die on the dielectric layer;
• forming an encapsulant covering the second die on the dielectric layer;
• forming a first circuit layer on the encapsulant, wherein the first die is electrically connected to the second die through the conductive connector and the first circuit layer;
• and
• forming a conductive terminal on the first circuit layer.

A manufacturing method of a package structure, comprising:

• forming a conductive connector on a carrier;
• disposing a first die on the carrier, wherein the first die comprises a first active surface and a first back surface opposite to the first active surface, the first active surface has a sensing area, and the first die is arranged such that the first active surface faces the carrier;
• disposing a second die on the first die, wherein the second die comprises a second active surface and a second back surface opposite to the second active surface, and the second die is arranged such that the second back surface faces the first back surface of the first die;
• forming an encapsulant on the carrier, wherein the encapsulant covers the first die and the second die;
• forming a circuit layer on the encapsulant;
• after forming the encapsulant, separating the carrier and the first die to expose the first active surface;
• forming a dam structure on the encapsulant, wherein the dam structure exposes the sensing area;
• and
• disposing a light-transmitting sheet on the dam structure.