Camera assembly, lens module, and electronic device
AssigneeNingbo Semiconductor International Corporation
InventorsDa CHEN, Mengbin LIU
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AssigneeNingbo Semiconductor International Corporation
InventorsDa CHEN, Mengbin LIU
Estimating the term…
The present disclosure provides a camera assembly, a lens module, and an electronic device. The camera assembly includes a photosensitive unit, functional components, a redistribution layer (RDL) structure, and an encapsulation layer, embedded with the photosensitive unit, the functional components, and the RDL structure. The photosensitive unit includes a photosensitive chip and an optical filter mounted on the photosensitive chip. The RDL structure and the optical filter are exposed from a top surface of the encapsulation layer. A highest top of the photosensitive chip and the functional components is exposed from a bottom surface of the encapsulation layer. The photosensitive chip and the functional components have solder pads facing the RDL structure and electrically connecting with the RDL structure.
A camera assembly, comprising:
A lens module, comprising:
Dependencies are inferred from the claim text.