Image sensor package with underfill and image sensor module including the same

An image sensor package comprising:

• an image sensor chip configured to convert light collected from an outside thereof into an electrical signal;
• a package substrate disposed under the image sensor chip and configured to process the electrical signal converted from the image sensor chip;
• a glass substrate disposed over the image sensor chip while being spaced apart from the image sensor chip;
• a seal pattern disposed between the package substrate and the glass substrate while surrounding the image sensor chip;
• and
• a protection pattern disposed on the package substrate outside the seal pattern,
• wherein the seal pattern comprises
• a first sub-pattern contacting the package substrate, and
• a second sub-pattern comprising a material different from a material of the first sub-pattern, the second sub-pattern contacting the glass substrate, and
• wherein the protection pattern has higher adhesiveness than the first sub-pattern.

An image sensor module comprising:

• a base substrate;
• an image sensor package disposed on the base substrate;
• an optical filter disposed on the image sensor package, the optical filter comprising an infrared (IR) filter;
• an optical system disposed on the optical filter, the optical system comprising a plurality of lenses;
• a bracket fixing and supporting the optical filter;
• and
• a housing fixing and supporting the optical system,
• wherein the image sensor package comprises
• an image sensor chip configured to convert light collected from an outside thereof into an electrical signal,
• a package substrate disposed on the base substrate and under the image sensor chip, the package substrate configured to process the electrical signal converted from the image sensor chip,
• a glass substrate disposed on the image sensor chip and the package substrate while having a light receiving space,
• a seal pattern disposed between the package substrate and the glass substrate and surrounding the image sensor chip, and
• a protection pattern disposed on the package substrate outside the seal pattern, the protection pattern comprising a single-component material,
• wherein the seal pattern comprises
• a first sub-pattern contacting the package substrate, and
• a second sub-pattern comprising a material different from a material of the first sub-pattern, the second sub-pattern contacting the glass substrate, and
• wherein the seal pattern comprises a material different from the material of the protection pattern.