Embedded packaging structure and method for manufacturing the same

A method for manufacturing an embedded packaging structure, the method comprising:

• A) preparing a substrate comprising a dielectric frame, wherein the substrate comprises a through hollow cavity surrounded by the frame and a metal via-column passing through a height of the frame;
• B) placing a first surface of the substrate onto a bearing part;
• C) placing an optical communication device into the hollow cavity of the substrate, wherein the optical communication device has a working face surface-mounted onto the bearing part;
• D) laminating or coating a dielectric packaging material onto a second surface of the substrate opposite to the first surface to form an insulating layer such that the dielectric packaging material fully fills a space between the optical communication device and the frame;
• E) thinning the insulating layer to reveal an end face of the metal via-column on the second surface;
• F) removing the bearing part to reveal the working face of the optical communication device and the end face of the metal via-column on the first surface;
• G) forming first and second wiring layers on the first and second surfaces of the substrate, wherein the first wiring layer is formed thereon with a working face opening to reveal the working face of the optical communication device from the first surface;
• and
• H) forming a blocking wall, surrounding the working face of the optical communication device, on the first surface of the substrate, wherein the blocking wall extends beyond the first surface in a direction away from the first surface.