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US 2022/0045038 A1Published application
Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsHee Woo AN, Kyung Suk OH, Man ho LEE
Life of this patent
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Abstract
A semiconductor package including a first package including a memory chip having a memory cell, and a capacitor structure disposed independently of the memory chip; and a second package including a logic chip configured to access the memory cell, wherein the capacitor structure is electrically connected to the memory chip and the logic chip.
Claims20
A semiconductor package, comprising:
- a first package including:
- a memory chip having a memory cell, and
- a capacitor structure disposed independently of the memory chip;
- and
- a second package including a logic chip configured to access the memory cell,
- wherein the capacitor structure is electrically connected to the memory chip and the logic chip.
3 more elements
A semiconductor package, comprising:
- an integrated stack capacitor (ISC) including a first surface and a second surface opposite to the first surface;
- a memory chip having one surface on the first surface of the ISC and including a plurality of memory cells;
- and
- a logic chip having one surface on the second surface of the ISC and being configured to access the memory cell,
- wherein the ISC is electrically connected to the memory chip and electrically connected to the logic chip.
2 more elements
A semiconductor package, comprising:
- a memory chip including a memory cell;
- a logic chip configured to access the memory cell;
- and
- an integrated stack capacitor (ISC) electrically connected to the memory chip and electrically connected to the logic chip.
1 more element
Dependencies are inferred from the claim text.