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US 2022/0045032 A1Published application
Semiconductor device
AssigneeKioxia Corporation
InventorsShinji YAMASHITA, Soichiro IBARAKI
Life of this patent
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Abstract
A semiconductor device according to the present embodiment includes a wiring substrate. A semiconductor chip includes a semiconductor substrate having a first face and a second face on the opposite side to the first face, and an SRAM on the side of the first face, and is stuck to the wiring substrate on the side of the second face. The semiconductor chip includes a first metallic layer provided in the semiconductor substrate between the SRAM and the wiring substrate.
Claims20
A semiconductor device comprising:
- a wiring substrate;
- and
- a semiconductor chip comprising a semiconductor substrate comprising a first face and a second face on an opposite side to the first face, and an SRAM (Static Random Access Memory) on a side of the first face, and being stuck to the wiring substrate on a side of the second face, wherein
- the semiconductor chip comprises a first metallic layer provided in the semiconductor substrate between the SRAM and the wiring substrate.
1 more element
Dependencies are inferred from the claim text.