Bonding apparatus and bonding method
AssigneeSemes Co., Ltd.
InventorGil Yong MOON
Life of this patent
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Abstract
A bonding apparatus includes a stage on which a substrate is seated, a gantry installed above the stage, a bonding unit configured to bond a chip to the substrate while moving along the gantry, and a control part moving the bonding unit to align the bonding unit with a bonding position on the substrate, controlling the bonding unit to allow the bonding unit to bond the chip at the bonding position, determining a movement distance of the bonding unit based on a weighted sum of a number of continuous operations and an idle time of the bonding unit.
Claims20
A bonding apparatus comprising:
- a stage on which a substrate is seated;
- a gantry installed above the stage;
- a bonding unit configured to bond a chip to the substrate while moving along the gantry;
- and
- a control part configured to move the bonding unit to align the bonding unit with a bonding position on the substrate, the control part being configured to control the bonding unit to allow the bonding unit to bond the chip at the bonding position,
- wherein the control part is configured to determine a movement distance of the bonding unit based on a weighted sum of a number of continuous operations and an idle time of the bonding unit.
A bonding method comprising:
- positioning a substrate on a stage;
- checking a bonding position on the substrate;
- moving a bonding unit to align the bonding unit with the bonding position of the substrate;
- and
- bonding a chip at the bonding position on the substrate,
- wherein the moving of the bonding unit comprises determining a movement distance of the bonding unit based on a weighted sum of a number of continuous operations of the bonding unit and an idle time of the bonding unit.
A bonding facility comprising:
- a loading part on which a container for accommodating a substrate is seated;
- a substrate conveying part configured to convey the substrate from the container seated on the loading part;
- a bonding part configured to bond a chip to the substrate provided from the substrate conveying part;
- and
- an inspection part configured to receive, from the substrate conveying part, the substrate processed by the bonding part and inspect the chip bonded to the substrate,
- wherein the bonding part comprises:
- a stage on which the substrate is seated;
- a gantry installed above the stage;
- a bonding unit configured to bond the chip to the substrate while moving along the gantry;
- and
- a control part configured to move the bonding unit to align the bonding unit with a bonding position on the substrate, the control part being configured to control the bonding unit to allow the bonding unit to bond the chip at the bonding position of the substrate, and
- wherein the control part determines a movement distance of the bonding unit based on a weighted sum of a number of continuous operations and an idle time of the bonding unit.
Dependencies are inferred from the claim text.