Bonding apparatus and bonding method

A bonding method comprising:

• positioning a substrate on a stage;
• checking a bonding position of the substrate;
• aligning a bonding unit of a bonding apparatus with the bonding position of the substrate;
• and
• bonding a chip at the bonding position of the substrate,
• wherein the moving of the bonding unit comprises:
• acquiring a first temperature value from a first temperature sensor installed on the bonding unit;
• acquiring a second temperature value from a second temperature sensor installed at a periphery of the bonding apparatus;
• and
• determining a movement distance of the bonding unit based on a weighted sum of the first temperature value and the second temperature value.

A bonding apparatus comprising:

• a loading part on which a container for accommodating a substrate is seated;
• a substrate conveying part configured to convey the substrate from the container seated on the loading part;
• a bonding part configured to bond a chip to the substrate provided from the substrate conveying part;
• and
• an inspection part configured to receive, from the substrate conveying part, the substrate processed by the bonding part and inspect the chip bonded to the substrate,
• wherein the bonding part comprises:
• a stage on which the substrate is seated;
• a gantry installed above the stage;
• a bonding unit configured to bond the chip to the substrate while moving along the gantry;
• a first temperature sensor installed on the bonding unit and configured to provide a first temperature value corresponding to a temperature of the bonding unit;
• a second temperature sensor installed in the vicinity of the bonding part and configured to provide a second temperature value corresponding to a temperature in the vicinity of the bonding part;
• and
• a control device configured to:
• cause the bonding unit to be aligned with a bonding position of the substrate,
• control the bonding unit to allow the bonding unit to bond the chip at the bonding position of the substrate, and
• determine a movement distance of the bonding unit based on a weighted sum of the first temperature value and the second temperature value.