Conductive paste

Abstract

The present invention addresses the problem of providing a conductive paste that achieves both low resistance and high adhesion strength (die shear strength) of the resulting conductive body after firing. The present invention provides a conductive paste comprising: (A) copper fine particles having an average particle diameter of 50 nm to 400 nm and a crystallite diameter of 20 nm to 50 nm; (B) copper particles having an average particle diameter of 0.8 μm to 5 μm and a ratio of a crystallite diameter to the crystallite diameter of the copper particles (A) of 1.0 to 2.0; and (C) a solvent.

Dependencies are inferred from the claim text.