Semiconductor device and method of manufacturing semiconductor device

A method of manufacturing a semiconductor device, comprising the steps of:

• preparing a semiconductor wafer including a plurality of chips arranged in a matrix on a front surface of the semiconductor substrate, each of the plurality of chips including an effective region including a semiconductor element and an ineffective region provided on a circumference of the effective region, the semiconductor wafer including a rear surface electrode on a rear surface of the semiconductor substrate;
• forming inspection wiring in the ineffective region of the front surface of the semiconductor wafer in such a manner that a first end of the inspection wiring is in contact with a semiconductor layer which is provided in the ineffective region on the front surface of the semiconductor wafer and electrically connected to the rear surface electrode, and so as to surround an outer periphery of the effective region;
• cutting the semiconductor wafer along a dicing line defined in the ineffective region between the plurality of chips adjacent to each other and outside of the inspection wiring with respect to the effective region thereby separating the plurality of chips into individual pieces;
• and
• applying a voltage between the inspection wiring and the rear surface electrode of each of the plurality of chips to detect a current flowing between the inspection wiring and the rear surface electrode, thereby inspecting an electrical connection state between the inspection wiring and the rear surface electrode.